APPLICATION-BASED THERMAL ANALYSIS OF AN ELECTRONIC SYSTEM USING NATURAL CONVECTION AND RADIATION

Abstract

Miniaturization of electronic devices has led to increased heat generation per unit volume, creating
serious thermal management challenges. Efficient removal of heat from electronic chips is critical to
ensure reliability, performance, and longevity.
In this study, Computational Fluid Dynamics (CFD) simulations are performed to analyze the thermal
behavior of a single electronic chip module. The chip is modeled using ANSYS SpaceClaim and analyzed
in ANSYS Fluent by solving governing equations for laminar viscous flow through a channel with
obstruction.