COMPUTATIONAL FLUID ANALYSIS ON ELECTRONIC DEVICES TO DEMONSRATE THE THERMAL EFFECTS ON MATERIAL

Abstract

The size of the electronic instruments as day by day decreases drastically and simultaneously the
number of functions per chip increases hugely. So, it’s a great challenge to remove the heat generated by
the chip efficiently. Many kinds of research works are going on in this direction for the past few
decades. CFD simulations have become more and more widely used in studies of electronic cooling. In
this study the cooling effects of the chip are analyzed using CFD simulations. The single chip module is
modeled using space claim. The analysis is carried out in fluent module by solving the governing
equations for a flow through a channel via obstruction. The laminar flow of viscous model for the two
metals (copper, aluminum) is analyzed for temperature variation in chip.