Numerical Analysis of an Advanced Vapor Chamber-Heat Sink Design Embedded with PCM

Abstract

As electrical appliances dissipate more heat now than ever before, effective cooling solutions are needed to
address the high temperature issues that arise in several interior electrical device regions. This research provides
a novel and sophisticated vapor chamber design that combines an enlarged surface area (fins) with a phase change
material (PCM). The novel method uses copper foam and PCM-HS29P as a thermal storage, water as the working
fluid, and pool boiling as the evaporation process. A numerical model and simulation study were carried out to
remove 225W of heat generated from an electronic chip sized 2.5x2.5 cm2 and maintain the chip temperature
below 70oC for a normal operation in order to explore the suggested design performance. The decision was made
that when the new design